NZXT BA-TP003-01 heat sink compound Thermal paste 6.3 W/m·K 3 g

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Heat Sink Compounds

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NZXT

Excellent thermal conductivity performance Non-electrically conductive and non-curing which prevents short-circuiting Easy to apply and clean Versatile uses (CPU, GPU) Long life span (Shelf life 3 years) NZXT High-performance thermal paste combines thermal conductivity, easy application, and long-term stability to ensure maximum heat transfer when cooling any build. Features Viscosity note 35~220*10³ mPa.s Specific gravity 3.5 g/cm³ Constitutive ingredients Zinc oxide Thermal conductivity 6.3 W/m·K Type Thermal paste Weight & dimensions Weight 3 g Packaging data Quantity per pack 1 pc(s) manual pdf

13.54 GBP