Powered by dual-socket 3rd Gen Intel Scalable processors, with 32 DIMMs and support for a maximum TDP of up to 270 W per socket GPU-optimized design allows one dual-slot GPU for AI workloads Up to 12 all-flash NVMe drives on front panel to enable extensive storage and high-throughput performance Up to three PCIe® 4.0 slots to enable higher bandwidth and improved data-transfer rates Flexible onboard LAN-module design to enable four 1 Gb LAN or two 10 Gb LAN options Flexible air- and liquid-cooling solution to achieve lower power-usage effectiveness (PUE) and optimized TCO for data centers Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency High power efficiency with redundant 1600 W or 1200 W 80 Plus® Titanium/Platinum power supplies 3rd Gen Intel® Xeon® Scalable ProcessorsThe latest 3rd Gen Intel® Xeon® Scalable Processors feature core counts from 8 to 40 cores and an array