Advanced Performance - Bi-symmetrial extruded fins and multi-functional apertures maximise surface area and natural convectional airflow to increase heat dissipation Effective Direct Contact Cooling - Internal passive thermal module with 4 copper heat pipes ensure effective heat transfer, with the case supporting processors up to 65W TDP for both Intel and AMD Mini-ITX platforms Total Silence - Fanless technology design eliminates the need for noisy mechanical fans so that true silence can be achieved Modern and Functional Design - Geometrically balanced case features a black anodised aluminium body with diamond-edge finish, for a beautifully crafted, modern cooling solution. Perfect for a wide range of applications and environments Universal Socket Fitting & Easy Installation - Easily adjustable thermal module with 4 copper heat pipes are universally compatible with Intel and AMD boards Fanless thin mini-ITX case for Intel® 12th Generation (Alder Lake) motherboards. With four USB 2.0