Categorie
Electrical engineering
Winkel
Wordery
Merk
Springer us
IC Interconnect Analysis : Springer : 9781475776744 : 1475776748 : 23 Mar 2013 : As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also incl
148.49 EUR
Aanbevelingen
Choose your language and region
Klarna is available around the world with a variable offering, choose one that suits you best.
Copyright © 2005-2024 Klarna Bank AB (publ). Headquarters: Stockholm, Sweden. All rights reserved. Klarna Bank AB (publ). Sveavägen 46, 111 34 Stockholm. Organization number: 556737-0431