BS EN IEC 60749-41:2020

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Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices|Mechanical testing, Electronic equipment and components, Test equipment, Electrical testing, Electric terminals, Shear testing, Vibration testing, Bonding, Low-pressure tests, Stress, Mass spectrometry, Pull-out tests, Thermal testing, Defects, Radioactive tracer methods, Semiconductor devices, Test specimens, Environmental testing, Specimen preparation, Fire tests, Visual inspection (testing), Dimensional measurement, Accelerated testing, Moisture measurement, Integrated circuits, Endurance testing, Storage, Classification systems, Leak tests, Damp-heat tests, Strength of materials, Thermal-shock tests, Testing conditions, Solderability testing, Marking, Torsion testing, Flammability, Temperature measurement

186 GBP