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Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly|Sheet materials, Printed-circuit boards, Electronic equipment and components, Laminates, Reinforced materials, Quality assurance, Specification (approval), Epoxy resins, Printed circuits, Impregnated materials, Multilayered printed boards, Printed-circuit bases, Flammability, Epoxides, Textile glass
134 GBP
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