Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Transfer adhesive films for flexible printed boards. Transfer adhesive film|Packaging, Films (states of matter), Printed-circuit boards, Reinforced materials, Flexibility, Test specimens, Coated materials, Designations, Printed circuits, Materials specification, Adhesives, Decalcomania paper, Specification (approval), Surface properties, Dimensional tolerances, Polyethylene terephthalate, Epoxy resins, Dimensions, Flammability, Approval testing, Strength of materials, Specimen preparation, Polyesters, Marking, Printed-circuit bases, Flow, Acceptance (approval), Electrical properties of materials