BS CECC 23600-801:1998

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Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections|Printed-circuit boards, Printed circuits, Electronic equipment and components, Electrical equipment, Electrical components, Laminates, Multiple, Assessed quality, Quality assurance systems, Capability approval, Acceptance (approval), Approval testing, Detail specification, Specification (approval), Finishes, Surface treatment, Metal coatings, Organic coatings, Designations, Inspection, Defects, Dimensional measurement, Thickness, Visual inspection (testing), Bonding, Electrical testing, Resistance measurement, Electrical insulation, Contaminants, Mechanical testing, Porosity measurement, Solderability testing, Conformity, Ageing tests, Specimen preparation, Preferred sizes, Edge socket connectors, Holes

186 GBP