pstrongemModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packagingemstrong presents the electromagnetic modelling and design of three major electromagnetic compatibility EMC issues related to the high-speed printed circuit board PCB and electronic packages signal integrity SI, power integrity PI, and electromagnetic interference EMI. The emphasis is put on two essential passive components of PCBs and packages the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.ppppThis book is designed to enhance worthwhile electromagnetic theory and mathematic